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Ottawa, Ontario, June 23, 2010 – Chipworks (www.chipworks.com), the world’s leader in reverse engineering and patent infringement analysis for semiconductors and microelectronic systems, has done a silicon level teardown on the Apple iPhone 4. For complete details and links to in-depth reports, visit http://www.chipworks.com/iPhone-4-teardown.aspx.
Key design win findings:
- The Apple A4 remains unchanged from the iPad
- TI has won the touch screen controller
- OmniVision is the suspected main image sensor – more analysis to follow
- STMicroelectronics scored two big inertial sensor wins for the accelerometer and gyroscope
- AKM has updated the magnetic sensor with a new device that promises better performance
- Broadcom continues to have success with Apple with its low power 802.11n with Bluetooth® solution

This teardown goes beyond just the package markings of the chips found inside and includes a consumer-level description of what makes the chips inside the Apple iPhone 4 so amazing. It also includes die photos and die markings where necessary to show the manufacturer of unmarked chips.
For semiconductor companies looking for more in-depth analysis, a full suite of reverse engineering reports is available on many of the key chips.
Chipworks has more information including package and die markings at: http://www.chipworks.com/iPhone-4-teardown.aspx